Christine Taylor

Taylor, C.L., Liu, X., Thadesar, P., Bakir, M. and Sitaraman, S.K. “Three-Dimensional Packaging with Through Silicon Vias and Strain Monitoring.” Poster at A Collaborative Approach to Meeting the Materials Genome Initiative in Atlanta, Ga (2014). [Honorable mentioned in the computing and electronics section of student poster competition]

Taylor, C.L. and Sitaraman, S.K., “Strain Sensing for Through Silicon Vias,” Technical Presentation at IMECE 2013 in San Diego, CA

Liu, X., Thadesar, P. A., Taylor, C. L., Kunz, M., Tamura, N., Bakir, M. S., and Sitaraman, S. K., "Dimension and Liner Dependent Thermomechanical Strain Characterization of Through-Silicon Vias using Synchrotron X-ray Diffraction," Journal of Applied Physics, Vol. 114, p. 064908, 2013.

Liu, X., Thadesar, P. A., Taylor, C. L., Kunz, M., Tamura, N., Bakir, M. S., and Sitaraman, S. K., "Thermomechanical Strain Measurement by Synchrotron X-ray Diffraction and Data Interpretation for Through-Silicon Vias," Applied Physics Letters, Vol.103, p.022107, 2013.

Liu, X., Taylor, C.L. and Sitaraman, S.K. “Three-Dimensional Stacked Dies with Through Silicon Vias: In-situ Stress Characterization and Thermo-Mechanical Reliability Assessment” at Glass Interposer Technology 2012 Workshop in Atlanta, GA [received Third Place in the student poster competition]

Taylor, C.L.  and Sitaraman, S.K., “In Situ Metallic Thin Film Sensors.” 62nd Electrical Components and Technical Conference (ECTC). 2012

Hurt, J.L., Carpenter, P.T., Taylor, C.L. and Robicheaux, F. “Positron and electron collisions with antiprotons in strong magnetic field.”  Journal of Physics B: 2008.

Zhang, J., Taylor, C.L., Hanson, J.D. and Robicheaux, F.. “Regular and chaotic motion of anti-protons through a nested penning trap with multipole magnetic fields.” Journal of Physics B: 2007.

Taylor, C. L., Zhang, J. and Robicheaux, F.. “Cooling of Rydgerg antihydrogen during radiactive cascade.“ Journal of Physics B: 2006.